One: LED packaging process
In general, the main steps of LED packaging are Die Bond, Wire Bond, Phosphor Dispensing, Lens Molding and testing.
The LED industry's development in packaging technology focuses on low thermal impedance and high reliability. In order to meet the characteristics of LEDs in the field of lighting, the development of high-brightness LED chip technology is working toward high-brightness luminous efficiency.
In addition, the industry has also tried to increase the brightness of the LED with high-power input, but while increasing the input power, it is accompanied by more heat. Therefore, if the heat dissipation cannot be effectively improved, even if the performance of the LED chip is good, the reliability will be greatly reduced due to the high temperature generated by the component. Therefore, the more the number of crystal chips in the multi-chip package, the higher the yield and the higher the technical threshold.
Two: Epoxy resin is an important material that must be used on energy-saving LEDs.
Epoxy resin is used in energy-saving LEDs. It must be used with important materials. In addition to epoxy resin, it is also used to contain hardeners, accelerators, flame retardants, clever agents, mold release agents and fillers. , pigments, lubricants and other ingredients are now introduced as follows:
1.1 Epoxy resin (EPOXY RESIN)
The types of epoxy resins used in the packaged plastic powder are bisphenol A (BISPHENOL-A), NOVOLAC EPOXY, cyclic aliphatic epoxy resin (CYCLICALIPHATIC EPOXY), epoxidized butadiene, and the like. The epoxy resin selected for packaging plastic powder must contain a low ion content to reduce the erosion of the aluminum strip on the surface of the semiconductor chip, while having high thermal deformation, good heat and chemical resistance, and hardener Has good reactivity. A single resin may be used, or two or more resins may be used in combination.
1.2 Hardener (HARDENER)
The hardener used in the packaged plastic powder top for crosslinking with epoxy resin can be roughly divided into two categories:
(1) Anhydrides (ANHYDRIDES);
(2) Phenolic resin (PHENOLICNOVOLAC).
The epoxy resin system which is hardened by phenol resin and hardened by an acid anhydride has the following characteristics: The system which is hardened by the phenol resin has a small amount of overflow gel, and the mold release is easy, and the moisture resistance and the non-disordering property are better than those of the acid anhydride hardening; Hardening with an acid anhydride requires a longer hardening time and a higher degree of post-hardening (POSTCURE); the component that is sensitive to surface leakage current is more compatible with the anhydride hardened by the anhydride; the hardened by the phenol resin is 150-175 There is better heat non-disruption between ~C, but the degree is higher than 175~ (2 is better with anhydride hardening).
In addition to electrical properties, the choice of hardener should also consider factors such as homework, moisture resistance, retention, price, and safety to the human body.
The hardening period of the epoxy resin encapsulated plastic powder (CURING CYCLE) is about 90-180 seconds, and it must be able to harden in a short time, so it is necessary to add a promoter to the plastic powder to shorten the hardening time.
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