The chairman of Tongfu Microelectronics believes that only domestic companies can unite to break the pattern of foreign companies unifying the world.
At the 5th China International IC Expo & Summit Forum held in Shenzhen yesterday, Shi Mingda, chairman of Tongfu Microelectronics (002156), and other industry experts called for domestic semiconductor design, manufacturing and packaging companies to establish a close Strategic alliances, work together to become bigger and stronger, to break the pattern of foreign-funded enterprises unifying the world.
Entering 2007, the domestic integrated circuit industry bid farewell to the 43% high growth in 2006 and entered a relatively stable development cycle. However, due to the uneven development of design, manufacturing and packaging testing in the semiconductor industry chain, the domestic semiconductor industry has always been outside the high-end market. "Advanced semiconductor products" have become the world of foreign-funded enterprises, and the Chinese semiconductor industry is urgently needed. Break through this bottleneck.
Foreign-invested companies occupy the high-end market
According to Shi Mingda, chairman of Tongfu Microelectronics, over the years, the industry generally believes that the technology threshold is relatively low, and the packaging and testing industry, which accounts for half of China's IC industry revenue, is the best development in the semiconductor industry chain. In the first half of this year, the domestic packaging and testing industry achieved sales of 32.7 billion yuan, a year-on-year increase of 36%.
Shi Mingda said that from the perspective of the global semiconductor industry chain, the packaging and testing industry is indeed the best link in the global semiconductor industry chain to China. However, from the perspective of a country's sustainable development, the current "advanced semiconductor products" are almost all foreign companies. In the high-end packaging and testing market with high added value, local companies have just started, and they are still out of the microprocessor, memory, and display driver IC packaging and testing market.
"In the face of the huge development space of the domestic semiconductor industry, as a local semiconductor company, we have to find the crux of the problem and face the challenges together," said Shi Mingda.
Decoupling of design and manufacturing
Shi Mingda believes that the domestic semiconductor design, manufacturing and packaging and testing companies are decoupled from each other, which is the crux of the problem that local semiconductor products are in the high-end market.
In China's 3G communication field, a number of design companies have launched 3G mobile phone baseband chips. Tongfu Microelectronics is also very optimistic about the huge market prospects of 3G mobile phone chips. For this reason, the company has also developed BGA packages for 3G mobile phone baseband chip packaging requirements. However, the company is worried that due to the maturity of the chip, it is not known when it will actually achieve mass production.
Obviously, the domestic design company as the industry leader has not given the opportunity to expand and strengthen the local packaging and testing enterprises not only in terms of scale but also in terms of technology. Similarly, due to the lack of market entry points and market environment suitable for growth, local packaging and testing enterprises have been unable to form the mass production capacity of advanced packaging and testing technology. When domestic design companies need advanced packaging and testing technology support, they often cannot provide services. Therefore, the decoupling of design, manufacturing and testing and testing links has caused the local semiconductor industry to develop at a higher level.
Joint breakthrough in industrial development bottleneck
Shi Mingda said that at present, domestic semiconductor design, manufacturing and packaging and testing enterprises are relatively weak. If it is possible to achieve the alliance between enterprises, on the one hand, it will be conducive to common development, on the other hand, it can solve China's semiconductor in a relatively short period of time. The problem of decoupling between the industry and the downstream.
It is understood that in recent years, with the technological advancement of domestic design companies, the demand for high-legged integrated circuit package testing such as QFP and LQFP has increased significantly, which has benefited many domestic packaging and testing companies. It can be seen that as the importance of the design, manufacture and packaging and testing of the different links in the industrial chain, if any one of the three links lags behind, it will inevitably affect the development of other links. The mutual integration of industries will be very beneficial to the local semiconductor industry to achieve leapfrogging technological breakthroughs, and to grow bigger and stronger together, in order to have a place in the high-end market.
Foshan Lighting: Interim net profit increased by 154.68% year-on-year (Figure) Wind and solar hybrid street lamp market has broad prospects (Figure) Why building materials supermarket is an important channel for lighting from Zhaojun to see China's lighting market eye-cutting test results: quality problems more semiconductor global Brewing a green light revolution
1
At the 5th China International IC Expo & Summit Forum held in Shenzhen yesterday, Shi Mingda, chairman of Tongfu Microelectronics (002156), and other industry experts called for domestic semiconductor design, manufacturing and packaging companies to establish a close Strategic alliances, work together to become bigger and stronger, to break the pattern of foreign-funded enterprises unifying the world.
Entering 2007, the domestic integrated circuit industry bid farewell to the 43% high growth in 2006 and entered a relatively stable development cycle. However, due to the uneven development of design, manufacturing and packaging testing in the semiconductor industry chain, the domestic semiconductor industry has always been outside the high-end market. "Advanced semiconductor products" have become the world of foreign-funded enterprises, and the Chinese semiconductor industry is urgently needed. Break through this bottleneck.
Foreign-invested companies occupy the high-end market
According to Shi Mingda, chairman of Tongfu Microelectronics, over the years, the industry generally believes that the technology threshold is relatively low, and the packaging and testing industry, which accounts for half of China's IC industry revenue, is the best development in the semiconductor industry chain. In the first half of this year, the domestic packaging and testing industry achieved sales of 32.7 billion yuan, a year-on-year increase of 36%.
Shi Mingda said that from the perspective of the global semiconductor industry chain, the packaging and testing industry is indeed the best link in the global semiconductor industry chain to China. However, from the perspective of a country's sustainable development, the current "advanced semiconductor products" are almost all foreign companies. In the high-end packaging and testing market with high added value, local companies have just started, and they are still out of the microprocessor, memory, and display driver IC packaging and testing market.
"In the face of the huge development space of the domestic semiconductor industry, as a local semiconductor company, we have to find the crux of the problem and face the challenges together," said Shi Mingda.
Decoupling of design and manufacturing
Shi Mingda believes that the domestic semiconductor design, manufacturing and packaging and testing companies are decoupled from each other, which is the crux of the problem that local semiconductor products are in the high-end market.
In China's 3G communication field, a number of design companies have launched 3G mobile phone baseband chips. Tongfu Microelectronics is also very optimistic about the huge market prospects of 3G mobile phone chips. For this reason, the company has also developed BGA packages for 3G mobile phone baseband chip packaging requirements. However, the company is worried that due to the maturity of the chip, it is not known when it will actually achieve mass production.
Obviously, the domestic design company as the industry leader has not given the opportunity to expand and strengthen the local packaging and testing enterprises not only in terms of scale but also in terms of technology. Similarly, due to the lack of market entry points and market environment suitable for growth, local packaging and testing enterprises have been unable to form the mass production capacity of advanced packaging and testing technology. When domestic design companies need advanced packaging and testing technology support, they often cannot provide services. Therefore, the decoupling of design, manufacturing and testing and testing links has caused the local semiconductor industry to develop at a higher level.
Joint breakthrough in industrial development bottleneck
Shi Mingda said that at present, domestic semiconductor design, manufacturing and packaging and testing enterprises are relatively weak. If it is possible to achieve the alliance between enterprises, on the one hand, it will be conducive to common development, on the other hand, it can solve China's semiconductor in a relatively short period of time. The problem of decoupling between the industry and the downstream.
It is understood that in recent years, with the technological advancement of domestic design companies, the demand for high-legged integrated circuit package testing such as QFP and LQFP has increased significantly, which has benefited many domestic packaging and testing companies. It can be seen that as the importance of the design, manufacture and packaging and testing of the different links in the industrial chain, if any one of the three links lags behind, it will inevitably affect the development of other links. The mutual integration of industries will be very beneficial to the local semiconductor industry to achieve leapfrogging technological breakthroughs, and to grow bigger and stronger together, in order to have a place in the high-end market.
Foshan Lighting: Interim net profit increased by 154.68% year-on-year (Figure) Wind and solar hybrid street lamp market has broad prospects (Figure) Why building materials supermarket is an important channel for lighting from Zhaojun to see China's lighting market eye-cutting test results: quality problems more semiconductor global Brewing a green light revolution
1
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