With the development of microelectronics technology and microelectronic packaging technology, epoxy molding compound has also been rapidly developed as a main electronic packaging material. Epoxy molding compound occupies more than 97% of the entire microelectronic packaging material market due to its high reliability, low cost, simple production process and suitable for large-scale production. Nowadays, it has been widely used in various packaging fields such as semiconductor devices, integrated circuits, consumer electronics, automobiles, military, and aviation. It plays an increasingly important role in promoting and promoting the development of microelectronics technology and microelectronic packaging technology. It should be said that microelectronic packaging materials play a decisive role in the process of upgrading electronic packaging technology, and have formed a development model of a whole generation of machines, one generation of packaging, and one generation of materials. Therefore, in order to develop advanced packaging technology, we must first research and develop advanced packaging materials.
1 Development history of epoxy molding compound
As early as the middle of the 20th century, in the early days of the production of plastic packaged semiconductor devices, epoxy and anhydride curing system molding materials were used for plastic transistor production. However, due to the low glass transition temperature (Tg) and high chloride ion content, it has not been widely adopted. In 1972, Morton Chemical Company of the United States successfully developed an o-cresol novolac epoxy-phenolic resin system molding compound. Since then, people have been continuously researching, improving, improving and innovating in this direction, and many new products have emerged. In 1975, a flame-retardant epoxy molding compound appeared. In 1977, a low-hydrolysis chlorine epoxy molding compound appeared. In 1982, a low-stress epoxy molding compound appeared. In 1985, a silicone-modified low-stress epoxy molding compound appeared. Before and after 1995, low-expansion, ultra-low expansion epoxy molding compound and low warpage epoxy molding compound appeared. Subsequently, new types of epoxy molding materials such as green environmental protection have emerged. Until 2004, Jiangsu Zhongdian Warwick Company was the first in China to successfully develop a green environmentally-friendly molding compound that does not contain halogen and does not contain antimony, and can meet the performance requirements of high-temperature reflow soldering of lead-free solder processes. With the continuous improvement of the performance of epoxy molding compound and the emergence of new varieties, the output has also increased year by year.
Domestic epoxy plastic sealing materials started late, and production began only in the mid-to-late 1980s. At that time, it was only manual operation by the workshop. The annual production was only tens of tons. The real mass production stage was 1992, and Jiangsu Zhongdian Warwick Company The implementation of the "Eighth Five-Year" technical transformation project, the introduction of the first automated production line abroad, the annual production capacity increased from tens of tons to more than 2,000 tons, achieving the first leap-forward development. Through more than ten years of development, domestic molding materials have been greatly developed. At present, the domestic production scale has reached about 30,000 tons (only one production scale of China Power Warwick Company is 12 000 tons). The product grade can only be packaged with diodes and high frequency. Low-power tube-to-package high-power devices, large-scale, very large-scale integrated circuits, packaged from DIP only to large-area DIP packages, and SOP, QFP/TQFP, PBGA for surface packaging, production technology from 5 μm to 3, 2, l, 0.8, 0.5, 0.35, 0.25 um, the development level has reached 0.13 ~ 0.10 μm.
2 Development status of epoxy molding compound
The development of microelectronic packaging technology has a great driving effect on the development of packaging materials. At the same time, the development of packaging materials has further promoted the development of packaging technology. Therefore, the two are mutually reinforcing and mutually restricting relationships. As one of the main electronic packaging materials, epoxy molding compound, with the rapid development of packaging technology, has increasingly shown the important role of the basic position and supporting position of epoxy molding compound. At present, the global epoxy molding compound manufacturers are mainly concentrated in Japan, the United States, South Korea, Taiwan and mainland China, mainly Sumitomo Bakelite, Nitto Denko, Hitachi Chemical, Matsushita Electric, Shin-Etsu Chemical, Toshiba, Hysol, Plaskon, Changchun, Taiwan , Lianyungang Warwick Electronics and other manufacturers. Nowadays, the mainstream products of epoxy molding compound are packaging materials suitable for 0.35~0.18μm feature size integrated circuits. The research level has reached 0.1~0.09μm, mainly used for packaging in the form of SOP, QFP, BGA, CSP and so on. It is estimated that the global demand for epoxy molding materials will reach 160,000 tons in 2005, and the sales will reach 1.6 billion yuan, as shown in Table 1. With the world's major packaging and testing manufacturers entering the Chinese mainland market, and have set up factories in mainland China, this has brought unprecedented development opportunities for domestic epoxy molding materials, and also attracted many foreign epoxy molding materials manufacturers in the mainland. Building a factory. At present, there are a total of 8 domestic manufacturers of epoxy molding materials. Including Jiangsu Zhongdian Warwick, Beijing Branch, Chengdu Qichuang, Zhejiang Xinqian Electronics, Foshan Yitong Electronics, Zhejiang Hengyao Electronics, Sumitomo (Suzhou), Changxing (Kunshan), Taiwan Changchun and Japan East are also planned in Changshu And Suzhou to build a factory. At present, domestic large-scale production technology can meet the 0.35~0.25μm technology, and the development level reaches 0.13~0.10μm. It is mainly used in the package of SIP, DIP, SOP, PQFP, PBGA and so on. In 2005, the domestic demand for epoxy molding compound will reach about 30,000 tons, as shown in Table 2 and Figure 1. Domestic epoxy plastic sealing materials are relatively early to start, have relatively large investment, and have strong basic raw materials as support, so the technology is developing rapidly and mature. Foreign epoxy plastic sealing materials manufacturers basically have their own R & D centers, all have the conditions and strength of independent development, production processes and equipment are very advanced, all have advanced large-scale production lines, including domestic foreign-funded enterprises, they are The products occupy most of the mid- to high-end market. Most of the domestic epoxy molding materials companies have small scale, weak technology, and backward production lines. Most of the products are medium and low-end products. Only Jiangsu Zhongdian Warwick Company has strong R&D institutions and teams, has the conditions and capabilities for independent development, and has many advanced modern automatic production lines, advanced equipment and production processes. However, there are still many gaps at home and abroad. To reduce the gap, we must: increase investment, including personnel training, technological innovation, process equipment improvement, etc.: seek domestic and international cooperation; accelerate the development of supporting basic raw materials, especially epoxy The development of new high performance epoxy resins for molding materials; support and tilt of government policies.
3 Future development trend of epoxy molding compound
With the rapid development of microelectronics technology and packaging technology, higher and higher requirements are put forward for epoxy packaging materials for electronic packaging materials. In the future, epoxy molding compound will be developed in the following aspects: (1) It is suitable for the development of ultra-large scale integrated circuits, thinning, miniaturization, high performance and low cost packaging; (2) BGA, CSP, MCM Advanced packaging forms such as SiP require the development of new epoxy molding materials; (3) can meet the green environmental requirements of halogen-free and ladder-free, especially for high-temperature 260 °C reflow soldering requirements for lead-free solder processes; (4) development Epoxy resin molding compound with high purity, bottom viscosity, multi-functionality, low water absorption, low stress and good heat resistance.
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