With today's portable storage media, you can do whatever you want, with the most out of your favorite albums, the latest albums released by your favorite band, holiday photos from last summer, and even terminals such as TVs and laptops. High-definition movies that are instantly played on your device, and you can enjoy unlimited entertainment anytime, anywhere. However, the better the image and audio quality, the greater the amount of data transferred between devices, and the faster the device interface needs to be.
Universal Serial Bus ( USB ) is easy to use with plug-and-play and is the leader in portable storage. USB 3.0 supports transfer rates of up to 5 Gbit/s, which is about ten times that of second-generation interfaces, and consumes only about one-third of its power. However, the new USB port is particularly sensitive to electrostatic discharge (ESD). It is enough to generate static electricity only by touching with a hand, and the electrical energy generated by the electrostatic discharge can damage the device or even make it completely inoperable. This situation is not only annoying to the user of the device, but for the manufacturer, if it involves product recall and brand image, it will undoubtedly pay a high price.
Infineon 's ESD3v3u4ulc damper diode protects the device from damage by absorbing electrical energy from the electrostatic discharge on the USB port. The diode has the lowest clamping voltage and dynamic resistance (0.23 μ) on the market today, and the diode response is extremely effective in the event of an electrostatic discharge. At 20kV, its ability to absorb large amounts of electrical energy exceeds the 8kV required by the industry's highest standard, IEC 61000-4-2. Although ESD3v3u4ulc provides excellent protection, it has minimal impact on the signal quality of high-speed connections. In the case of traditional solutions, effective protection is achieved at the expense of signal integrity, resulting in poor high-speed signal quality.
In addition, Infineon combines ESD3v3u4ulc with its latest packaging technology: the TSLP-9-1 enables optimal printed circuit board (PCB) design and a diode protects up to four data lines simultaneously. Especially for high-speed interfaces, the right component package helps ensure fast signal transmission without compromising signal quality.
SHENZHEN CHONDEKUAI TECHNOLOGY CO.LTD , https://www.szsiheyi.com